Wand Depaneling

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Wand Depaneling services are a key part of the Larsen offering.

As an extension of our tooling expertise, Larsen builds an elite punch and die based depaneling system for the printed circuit board industry. By greatly reducing and eliminating any stress or flex during the separation process of multiple populated PCB’s, the WAND Depaneling System safeguards against fractured joints and excess burrs, and leaves disjointed arrays quickly and cleanly separated. The WAND System is perfectly suited to accommodate medium to high volume PCB separation needs.

The Singulation Process 3016AT / 5016AT

The standard WAND DepanelingSingulation press is capable of punching individual or multiple populated panels within any specified working area. The operation is semi-automatic. Once the operator places the populated array into the “Depaneler”, a shuttle transports the tool into the enclosed cutting area for the separation. The bottom tool then returns to the operator, with the PCB board quickly and cleanly separated, and the cycle is complete. Total cycle time = 12.0

Wand Depaneling

Wand Depaneling

Wand Depaneling

Specifications

Tooling Change
Inherent in the design of the press, product changeover is complete in under 3 minutes.
Depaneler
The standard Singulation tool is capable of punching individual or multiple populated panels. Tooling weight less than 125 lbs.
Features
  • Air/Oil Power Pack
  • Quick Change Clamping
  • Die Package
  • Storage Elevator (Optional)
  • Air Logic Control
  • 12 second cycle time
  • Fully Enclosed Structure
  • 1 1/2” Maximum Component
  • Height including board thickness
Saftey
  • Optical Touch Controls
  • Completely Guarded Cutting area
  • Two Anti-Repeat / Anti-Tie Down
  • Finger Controlled Start Mechanisms
  • Built In Safety Light Curtains
  • Package position sensors prevent power pack from cycling if package is out of position
  • (4) Pneumatic Clamps Lock upper Package in Position

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